CF Flanges
- UHV Sealing Performance: Knife-edge + metal gasket design for ultra-low leak rates.
- High Temperature Capability: Suitable for high-temperature bake-out in vacuum systems.
- Precision Machined Surfaces: Smooth sealing faces and tight dimensional control.
- Multiple Styles Available: Blank, bored, rotatable, non-rotatable, tapped and through-hole designs.
- Standard & Custom Sizes: From small instrumentation ports to large chamber flanges.
Technical Specifications
| Item | Specification |
| Product Name | CF Flanges (ConFlat Ultra-High Vacuum Flanges) |
| Size Range | Standard CF sizes or according to customer drawing |
| Flange Types | Blank, bored, rotatable, non-rotatable, tapped, through-hole |
| Sealing Type | Knife-edge metal gasket (typically oxygen-free copper) |
| Typical Materials | SS304 / 304L / 316L; other stainless or special alloys on request |
| Pressure / Vacuum Range | High vacuum to ultra-high vacuum (system-dependent) |
| Temperature Capability | Suitable for high-temperature bake-out (limited by material and gasket) |
| Surface Finish | Precision-machined sealing faces for reliable gasket compression |
| Standards / Interfaces | Compatible with common CF/UHV industry dimensions |
| Production Basis | Manufactured according to customer drawings or specified CF standards |
Customization Options
- Size and Bore: Any standard CF size or fully custom diameter and bore per drawing.
- Flange Style: Choice of blank, bored, rotatable, non-rotatable, tapped, or special flange designs.
- Material Selection: 304 / 304L / 316L stainless steel or other alloys for special environments.
- Surface Finish: Custom sealing-face finish and polishing level on request.
- Hole Pattern & Threading: Custom bolt-hole count, pattern, and tapped/through-hole options.
- Weld Preparation: Tailored weld neck lengths, bevels and tube transitions.
Applications
- Ultra-high vacuum (UHV) chambers and components
- Particle accelerators and beamlines
- Synchrotron and neutron research facilities
- Semiconductor processing equipment
- Surface science and analytical instruments (XPS, AES, STM, etc.)
- Thin-film deposition and sputtering systems
- Cryogenic and space-simulation vacuum systems